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Chief Economic Adviser of India: Continuing to support high-quality capital expenditure will be the driving force to maintain India's economic growth.Spring Festival travel rush's first day train tickets will be sold on 31st of this month. The student booking service was launched today. It was learned from China State Railway Group Co.,Ltd. today (12th) that Spring Festival travel rush will be launched on 14th of January next year in 2025, and Spring Festival travel rush's first day train tickets will be sold on 31st of this month. In view of students booking tickets during Spring Festival travel rush, Railway 12306 launched a new function today.Indian Trade Secretary: India will need more imports to maintain high growth, and should not be too worried about the trade deficit.

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Musk is going to melt the Statue of Liberty? Musk also responded to the rumors of foreign media. Recently, a screenshot appeared on the American network. The content was that CNN published a report saying that Musk, a well-known American entrepreneur, was going to melt the Statue of Liberty in the United States to make a limited edition electric pickup truck. However, Reuters later denied that the CNN report was forged. A spokesman for CNN also told Reuters that the CNN report in the screenshot was forged, and CNN had never published such a report. At present, Musk himself has responded to this matter in a teasing tone on his social platform X. Musk wrote in three posts: "No, I will melt it 1000% (Statue of Liberty)"; "With a laser eye from space"; "and then cast it again before no one notices";The word "Jin" was elected as the Japanese Chinese character of the year in 2024. According to NHK, on the afternoon of December 12, local time, Kiyomizu Temple in Kyoto, Japan announced the word "Jin" as the Japanese Chinese character of the year in 2024. According to the report, this year's word "gold" has two meanings. One is that athletes such as Japanese Olympic athletes have performed well and issued a shining "golden light"; The second is the political black gold problem in Japanese politics and frequent robberies caused by underground part-time jobs, because the pronunciation of "gold" in Japanese, like the word "shadow", also implies the meaning of "shadow". (China News Network)

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)The daily limit of Sanyuan shares and Panda dairy products rose due to changes in the dairy sector, while Sanyuan shares and Panda dairy products rose due to changes in the dairy sector. The western animal husbandry industry rose by over 15%, followed by Ligao food, qiaqia food and Nanqiao food.The USD/JPY rose more than 30 points against the Japanese yen in the short term and is now reported at 152.56.